JPH0314332Y2 - - Google Patents
Info
- Publication number
- JPH0314332Y2 JPH0314332Y2 JP13323286U JP13323286U JPH0314332Y2 JP H0314332 Y2 JPH0314332 Y2 JP H0314332Y2 JP 13323286 U JP13323286 U JP 13323286U JP 13323286 U JP13323286 U JP 13323286U JP H0314332 Y2 JPH0314332 Y2 JP H0314332Y2
- Authority
- JP
- Japan
- Prior art keywords
- mold
- resin
- cull
- pot
- lower mold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 90
- 229920005989 resin Polymers 0.000 claims description 90
- 238000000465 moulding Methods 0.000 claims description 19
- 238000005580 one pot reaction Methods 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Landscapes
- Moulds For Moulding Plastics Or The Like (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13323286U JPH0314332Y2 (en]) | 1986-08-29 | 1986-08-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP13323286U JPH0314332Y2 (en]) | 1986-08-29 | 1986-08-29 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6339524U JPS6339524U (en]) | 1988-03-14 |
JPH0314332Y2 true JPH0314332Y2 (en]) | 1991-03-29 |
Family
ID=31033356
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP13323286U Expired JPH0314332Y2 (en]) | 1986-08-29 | 1986-08-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0314332Y2 (en]) |
-
1986
- 1986-08-29 JP JP13323286U patent/JPH0314332Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS6339524U (en]) | 1988-03-14 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US6444157B1 (en) | Method of resin molding | |
US5204122A (en) | Mold for use in resin encapsulation molding | |
JPH0314332Y2 (en]) | ||
JPH03202327A (ja) | 樹脂成形用金型面のクリーニング方法とこの方法に用いられるクリーニング用シート部材及び連続自動樹脂成形方法 | |
JPS622456B2 (en]) | ||
JP2626971B2 (ja) | 電子部品の樹脂封止成形方法及び金型 | |
US6682952B2 (en) | Method of forming the resin sealed semiconductor device using the lead frame | |
JP2581113B2 (ja) | 半導体装置のモールド方法および装置 | |
JP2857075B2 (ja) | 半導体パッケージの製造方法と、これに用いられるフィルムおよび金型 | |
JP3139860B2 (ja) | 樹脂モールド装置 | |
JPH0237856B2 (ja) | Jushimoorudohoho | |
JPH06177191A (ja) | 樹脂モールド装置 | |
JP2675417B2 (ja) | マトリクスフレームのディゲート方法 | |
JP2666630B2 (ja) | 半導体装置の製造方法 | |
JPH0430182B2 (en]) | ||
JP2597010B2 (ja) | モールド用金型 | |
JPH0213141Y2 (en]) | ||
JPH0637129A (ja) | モールド金型、リードフレーム及び半導体装置の製造方法 | |
JPH06166050A (ja) | 樹脂モールド装置 | |
JPH0644105Y2 (ja) | 樹脂モ−ルド型半導体装置のリ−ドフレ−ム | |
US6911719B1 (en) | Lead frame for resin sealed semiconductor device | |
JPH0482236A (ja) | 電子部品の樹脂封止成形方法及び装置 | |
JPH043770Y2 (en]) | ||
JPH05109800A (ja) | 半導体装置の樹脂封止方法および半導体装置用樹脂封止装置 | |
JP2736554B2 (ja) | 樹脂封止成形方法及び樹脂注入ゲートの構成方法 |